US Patent for High density organic bridge device and method Patent ... | 寵物協尋網
3illustratesacrosssectionalviewofanorganicbridgeplacedwithinasubstrate...3bylayer310,312and314and316....Patentnumber:9548264
CROSS-REFERENCE TO RELATED APPLICATIONThis application is a continuation of U.S. patent application Ser. No. 13/722,203, filed Dec. 20, 2012, which is incorporated by reference herein in its entirety.
TECHNICAL FIELDEmbodiments pertain to integrated circuit (IC) dies, multi-chip packages, and associated methods. More particularly, embodiments pertain to using an organic bridge in an organic package substrate to interconnect dies with a high density interconnect.
BACKGROUNDIn order to enhance performance, processing unit products are increasingly integrating multiple die within the processing unit package in a side-by-side or other multi-chip-module (MCM) format. In traditional MCM format, the chip die are interconnected via connections within the substrate. One way to increase the input-output (IO) capacity is to connect the ...
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